The World Congress on Smart Materials and Structures which will be held in Frankfurt from March 18-19, 2020, we sincerely invite you to this excellent meeting with great scientists from worldwide and sharing new achievements in Smart Materials World. The fruitful conference program includes plenary lectures, breakout sessions, panel discussion, poster showcase on a variety of topics and various programs for participants from different countries around the world.
Smart materials are one of the most important researching directions in the development of high-tech new materials. Their properties can react to reversible changes in their environment by an external condition. Smart materials help in removing the boundaries between structural and functional materials, which may result in a significant revolution in materials science development. Based on its significance, Smart Materials 2020 is dedicated to providing a platform to make up a dialogue between industries and academic organizations and technology transfer from research to industry.
World Congress on Smart Materials and Structures will be organized around the theme "To explore the world of smart materials by diminishing the gap between the consortium" Smart Materials 2020 is compromised of 8 tracks and 37 sessions designed to offer comprehensive sessions that address current issues in Smart Materials 2020.
Smart Materials 2020 plans to shoot for 75+ oral presentations in breaking research of Smart Materials Science and Technologies. 150+ world-renowned experts, academicians, senior scientists, industry executives and project leaders from 40 leading countries will get together to address the topics, issues, best practices and trends necessary to make the right decisions to guide their business strategies, and future science and technology direction. Meanwhile, it provides exhibition opportunities for industries to showcase their products and services with Smart Materials Science Applications.
All accepted abstracts will be published in respective Allied Academies Journals.
Abstracts will be provided with Digital Object Identifier by
